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Cited article:

Improvement of heteroepitaxial growth by the use of twist-bonded compliant substrate: Role of the surface plasticity

G. Patriarche and E. Le Bourhis
Journal of Electronic Materials 32 (8) 861 (2003)
https://doi.org/10.1007/s11664-003-0201-4

Influence of the twist angle on the plasticity of the GaAs compliant substrates realized by wafer bonding

G Patriarche and E Le Bourhis
Journal of Physics: Condensed Matter 14 (48) 12967 (2002)
https://doi.org/10.1088/0953-8984/14/48/339

Study of the mechanical properties of ceramic materials by the nanoindentation technique

J. Woirgard, C. Tromas, J.C. Girard and V. Audurier
Journal of the European Ceramic Society 18 (15) 2297 (1998)
https://doi.org/10.1016/S0955-2219(98)00083-1

A new technology for nanohardness measurements: principle and applications

J. Woirgard, J-C. Dargenton, C. Tromas and V. Audurier
Surface and Coatings Technology 100-101 103 (1998)
https://doi.org/10.1016/S0257-8972(97)00597-5

Nanoindentation characterization of SiC coatings prepared by dynamic ion mixing

J. Woirgard, T. Cabioc'h, J.P. Rivière and J.C. Dargenton
Surface and Coatings Technology 100-101 128 (1998)
https://doi.org/10.1016/S0257-8972(97)00601-4