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Correlation analysis between formation process of SF6 decomposed components and partial discharge qualities

Ju Tang, Fuping Zeng, Jianyu Pan, et al.
IEEE Transactions on Dielectrics and Electrical Insulation 20 (3) 864 (2013)
https://doi.org/10.1109/TDEI.2013.6518956

Effect of the percentage of SF6(100 –10 –5 ) on the decomposition of SF6–N2mixtures under negative dc coronas in the presence of water vapour or oxygen

J Diaz, A M Casanovas and J Casanovas
Journal of Physics D: Applied Physics 36 (13) 1558 (2003)
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Decomposition of high-pressure (400 kPa) SF6and SF6/N2(10:90) mixtures submitted to negative or 50 Hz ac corona discharges in the presence of water vapour and/or oxygen

L Vial, A M Casanovas, J Diaz, I Coll and J Casanovas
Journal of Physics D: Applied Physics 34 (13) 2037 (2001)
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Influence of reactive SF/sub x/ gases on electrode surfaces after electrical discharges under SF/sub 6/ atmosphere

C. Beyer, H. Jenett and D. Klockow
IEEE Transactions on Dielectrics and Electrical Insulation 7 (2) 234 (2000)
https://doi.org/10.1109/94.841815

Analysis of spark decomposition products of SF6 using multivariate mid-infrared spectrum evaluation

R. Kurte, H.M. Heise and D. Klockow
Journal of Molecular Structure 480-481 211 (1999)
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Decomposition products from negative and 50 Hz ac corona discharges in compressed SF6and SF6/N2(10:90) mixtures. Effect of water vapour added to the gas

L Vial, A M Casanovas, I Coll and J Casanovas
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