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Article cité :

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

R Straessle, Y Pétremand, D Briand, M Dadras and N F de Rooij
Journal of Micromechanics and Microengineering 23 (7) 075007 (2013)
https://doi.org/10.1088/0960-1317/23/7/075007

A new method for the hermeticity testing of wafer-level packaging

Djemel Lellouchi, Jérémie Dhennin, Xavier Lafontan, et al.
Journal of Micromechanics and Microengineering 20 (2) 025031 (2010)
https://doi.org/10.1088/0960-1317/20/2/025031

Influence of firing temperature on interface adhesion between screen-printed Ag film and BaTiO3 substrate

Chao-Yu Lee, Michel Dupeux and Wei-Hsing Tuan
Materials Science and Engineering: A 467 (1-2) 125 (2007)
https://doi.org/10.1016/j.msea.2007.02.077

Vacuum measurement in wafer level encapsulations by interference microscopy

A. Bosseboeuf, J. P. Grandchamp, C. Breluzeau, et al.
Microsystem Technologies 12 (10-11) 1063 (2006)
https://doi.org/10.1007/s00542-006-0160-9

Imbalanced Mach-Zehnder interferometer integrated in micromachined silicon substrate for pressure sensor

H. Porte, V. Gorel, S. Kiryenko, et al.
Journal of Lightwave Technology 17 (2) 229 (1999)
https://doi.org/10.1109/50.744229

Effect of clamping conditions and built-in stresses on the thermopneumatic deflection of SiO2/Si membranes with various geometries

C Malhaire, M Le Berre, D Febvre, D Barbier and P Pinard
Sensors and Actuators A: Physical 74 (1-3) 174 (1999)
https://doi.org/10.1016/S0924-4247(98)00312-4

Investigation of The Mechanical Properties and Adhesion of P.V.D. Tungsten Films on Si and Silicon Compounds by Bulge and Blister Tests

Michel Dupeux, Alain Bosseboeuf and Denis Buttard
MRS Proceedings 518 87 (1998)
https://doi.org/10.1557/PROC-518-87