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Article cité :
E. Bonnotte , P. Delobelle , L. Bornier , B. Trolard , G. Tribillon
J. Phys. III France, 5 7 (1995) 953-983
Citations de cet article :
7 articles
Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging
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A new method for the hermeticity testing of wafer-level packaging
Djemel Lellouchi, Jérémie Dhennin, Xavier Lafontan, et al. Journal of Micromechanics and Microengineering 20 (2) 025031 (2010) https://doi.org/10.1088/0960-1317/20/2/025031
Influence of firing temperature on interface adhesion between screen-printed Ag film and BaTiO3 substrate
Chao-Yu Lee, Michel Dupeux and Wei-Hsing Tuan Materials Science and Engineering: A 467 (1-2) 125 (2007) https://doi.org/10.1016/j.msea.2007.02.077
Vacuum measurement in wafer level encapsulations by interference microscopy
A. Bosseboeuf, J. P. Grandchamp, C. Breluzeau, et al. Microsystem Technologies 12 (10-11) 1063 (2006) https://doi.org/10.1007/s00542-006-0160-9
Imbalanced Mach-Zehnder interferometer integrated in micromachined silicon substrate for pressure sensor
H. Porte, V. Gorel, S. Kiryenko, et al. Journal of Lightwave Technology 17 (2) 229 (1999) https://doi.org/10.1109/50.744229
Effect of clamping conditions and built-in stresses on the thermopneumatic deflection of SiO2/Si membranes with various geometries
C Malhaire, M Le Berre, D Febvre, D Barbier and P Pinard Sensors and Actuators A: Physical 74 (1-3) 174 (1999) https://doi.org/10.1016/S0924-4247(98)00312-4
Investigation of The Mechanical Properties and Adhesion of P.V.D. Tungsten Films on Si and Silicon Compounds by Bulge and Blister Tests
Michel Dupeux, Alain Bosseboeuf and Denis Buttard MRS Proceedings 518 87 (1998) https://doi.org/10.1557/PROC-518-87